By C.B. Sobhan
Preface advent to Microscale warmth move Microscale warmth move: a contemporary road in strength delivery state-of-the-art: a few Introductory feedback assessment of Microscale shipping Phenomena Discussions on Size-Effect habit primary strategy for Microscale warmth move creation to Engineering purposes of Microscale warmth move Microscale warmth Conduction overview of Conduction warmth Transfer Read more...
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Extra info for Microscale and Nanoscale Heat Transfer : Fundamentals and Engineering Applications
Sample text
Peterson. 1993. A micro heat pipe catheter for local tumor hyperthermia. S. Patent No. 5,190,539. I. L. Tien. 1990. Size effect on thermal conductivity of high Tc thin film superconductors. Journal of Heat Transfer 112: 872–880. I. E. Goodson. 1991. Heat transfer regimes in microstructures. American Society of Mechanical Engineers Dynamic Systems and Control 32: 31–47. , A. D. Killion. 2005. Condensation pressure drop in circular microchannels. Heat Transfer Engineering 35: 26–28. V. B. Sobhan. 2003.
The analysis method should also be based on considerations of the temperature levels and heating conditions encountered. The mean free path has a temperature dependence, which shows an increase with decreasing temperature; the analysis at low and cryogenic temperatures should consider size effects as very significant aspects in the modeling of these situations. New hypotheses, other than lattice vibrations, have been put forward to describe energy transport processes, such as a wave-type transport occurring in the conducting medium.
S. W. Knight. 1994. Optimal design of microchannel heat sinks: A review. Optimal Design of Thermal Systems and Components ASME HTD 279: 65–78. L. 1990. Microchanneled structures, microstructures, sensors and actuators. American Society of Mechanical Engineers Dynamic Systems and Control 108: 171–174. , H. Nariai, and T. Shimura. 1989. Pressure drop in subcooled boiling in narrow tubes, Heat Transfer-Japanese Research 18: 70–82. D. 1999. Classical Electrodynamics. 3rd ed. New York: John Wiley & Sons.
